E3200 G3 is supplied by HuaShengBoYe with verified origin and traceable batch information. We quote against your BOM, confirm packaging and date codes, and ship worldwide from Shenzhen.
1. Calculation and Memory CPU：2 × Intel ? Xeon ? Scalable Cascade Lake， Up to 205 W per unit, supporting NUMA Balance design Memory: 16 x DDR4 DIMM (RDIMM/LRDIMM), speed 2933 MT/s, maximum 1 TB; optional 8 x Autoteng ? DCPMM， Expand to 2 TB capacity memory 2. Storage and Expansion Disk position (flexible combination) SFF: 2 x SATA/SAS+4 x U.2 NVMe (front) M. 2:4 x SATA/NVMe (built-in boot disk) LFF: 4 × 3.5 "HDD (optional) RAID: Supports 0/1/10/5/6/50/60, optional 12 Gb RAID card with cache protection PCIe: up to 8 slots (x8/x16 flexible split), can accommodate 25/100 GbE smart network cards, GPUs, FPGAs, and other edge acceleration cards 3. Network and Interface OCP 3.0: Supports 10/25/100 GbE hot swappable network cards, compatible with RoCE v2 low latency networks Standard interface: 2 × 1 GbE electrical port (business) 1 × 1 GbE management port (HDM) 4 x USB 3.0, 2 x VGA, 1 x Console 4. Reliability and environmental adaptability Chassis: 440 × 450 × 87.5 mm (2U), with a depth of only 450 mm, can accommodate a 600 mm communication cabinet Wide temperature operation: long-term 0 ℃ -45 ℃, short-term -5 ℃ -50 ℃; Humidity 5% -90% (short-term) Anti harsh environment: meets ETSI EN 300 019 class 3.1, GB4798-3C1 corrosive gas, 3M2 vibration, and 7-intensity seismic resistance (telecom grade) Power supply: 1+1 redundant, supports 220 V AC/-48 V DC dual input, hot swappable and maintained Heat dissipation: 3+1 redundant fan, post maintenance, supports dynamic frequency conversion, no tool disassembly and assembly
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