Power Edge R770 is supplied by HuaShengBoYe with verified origin and traceable batch information. We quote against your BOM, confirm packaging and date codes, and ship worldwide from Shenzhen.
Processor and Memory 2 x Intel Xeon 6 (6700P/6500 series), with a maximum of 144 cores per chip (P-core 32C+E-core 112C), TDP 350W 32 × DDR5 RDIMM, speed 6400 MT/s, maximum 2 TB, bandwidth increased by more than 50% compared to the previous generation Storage and IO Front window options: -16 x EDSFF E3. S Gen5 NVMe, maximum 244 TB – 8 × 2.5″ NVMe + 8 × 2.5″ SAS/SATA Rear window: 2 × 2.5 "NVMe/SATA+2 × M.2 NVMe (BOSS-N1, HWRAID 1) Support GPU Direct Storage, 4 x CD8P NVMe can run full PCIe Gen5 x16 bandwidth (≈ 50 GB/s) Expansion and GPU Motherboard 10 x PCIe 5.0 slots (x16/x8)+2 x OCP 3.0, can accommodate 4 x 75W single width GPU or 2 x 300W dual width GPU Optional 400 GbE, NDR InfiniBand, DPU to meet AI distributed training and low latency storage networks Energy efficiency and heat dissipation Intelligent air cooling optimization, cellular duct+hot swappable redundant fan, 35 ° C without frequency reduction 600 W-2800 W 80 PLUS titanium power supply, supporting AC/HVDC; Compared to the previous generation, the performance per watt has increased by 69%, and the rack density has increased by 80% Management and Security iDRAC9 Datacenter， Support zero contact deployment CloudIQ AIOps、 telemetry Silicon trust root, signature firmware, TPM 2.0, MFA multi factor authentication, full lifecycle security reinforcement Tested Performance (Storage Review, May 2025) MariaDB: Dual channel 5.8 million TPM, single channel 3.15 million TPM, leading comparison platforms 7-Zip: Comprehensive 261 GIPS, more balanced compression efficiency Y-Cruncher: 100 billion bit π calculation takes only 491 seconds, which cannot be completed by the comparison platform Cinebench R23: 1272 pts for single core, 74710 pts for multi-core; Geekbench 6 Single Core 1797, Multi Core 15880, Single Core Leading 53%
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