R2900 G3 is supplied by HuaShengBoYe with verified origin and traceable batch information. We quote against your BOM, confirm packaging and date codes, and ship worldwide from Shenzhen.
1. Calculation and Memory CPU：2 × Intel ? Xeon ? Scalable 1/2 Generation (or Lanqijin Catch) ?）， Single maximum 20 cores, 125 W Memory: 16 x DDR4 DIMM, speed 2933 MT/s, maximum 2 TB; supports 8 x Autoteng ? DCPMM， Expand to 4 TB capacity memory 2. Storage capacity Disk position: Front 12 × 3.5 "or 25 × 2.5" (including 16 × NVMe options) Rear 2 × 2.5 "+2 × 3.5" combination, with a maximum of 31 hard drives for the entire machine RAID: Onboard support for 0/1/10/5; Optional 12 Gb RAID card, supports 0/1/10/5/6/50/60, cache up to 4 GB FBWC Startup disk: Dual M.2 SATA/NVMe RAID1 3. Expansion and Networking PCIe 3.0: 8 available slots (including dedicated slots for array cards/network cards), can accommodate GPU, FC, 25/40 GbE GPU: Up to 2 dual width GPUs per node, suitable for lightweight AI inference/VDI Network: Onboard 1 × 1 GbE management port Optional mLOM 4 × 1 GE or OCP 3.0 network card (1/10/25 GbE) 4. Reliability and energy efficiency Power supply: 550 W-1600 W Platinum/Titanium 1+1 redundancy, optional -48 V DC/336 V HVDC Heat dissipation: Hot swappable redundant fan, operating temperature range of 5 ℃ -50 ℃ (slightly different depending on configuration) MTBF：> 100 000 h， Certified by CCC, CE, CB, CECP, etc 5. Management and Security HDM: Agent free out of band management, supporting Redfish/IPMI/SNMP, virtual KVM, and batch firmware upgrades FIST: New H3C Full Lifecycle Deployment Tool, Zero Contact Online, Template based OS Installation Security: TCM/TPM 2.0, Chassis Intrusion Detection, Firmware Digital Signature
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