R6900 G3 is supplied by HuaShengBoYe with verified origin and traceable batch information. We quote against your BOM, confirm packaging and date codes, and ship worldwide from Shenzhen.
1. Calculation and Memory CPU: 4 Intel chips ? Xeon ? Gold/Platinum， A single chip with a maximum of 28 cores and 205 watts, with a total of 112 cores and 224 threads for the entire machine Memory: 48 x DDR4 DIMM, speed 2933 MT/s, maximum 6 TB; supports 24 x Autoteng ? DCPMM， Expand to 8 TB capacity memory 2. Storage capacity Disk slots: front 48 × 2.5 "or 16 × U.2 NVMe, rear 2 × 2.5", with a maximum of 50 hard drives for the entire machine RAID: onboard SATA RAID 0/1/10/5; Optional 12 Gb SAS RAID card, supports 0/1/10/5/6/50/60, cache 4 GB FBWC 3. Expansion and Networking PCIe 3.0: 20 full high availability slots (including 1 mLOM network card dedicated slot), can be plugged into GPU, 100 GbE, FC HBA GPU: Supports 2 dual width or 6 single width GPUs to meet AI training needs VDI、 render Network: Onboard 1 × 1 GbE HDM; MLOM supports 4 × 1 GE/2 × 10 GE electrical/optical ports, compatible with NCSI 4. Reliability and energy efficiency Power supply: 800 W/1200 W/1600 W Platinum/Titanium 1+1 or 2+2 redundancy, 96% energy efficiency; Supports 336 V HVDC Heat dissipation: Hot swappable redundant fan, running at 5 ℃ -45 ℃ without derating MTBF：> 100 000 h， Certified by CCC, CE, CB 5. Management and Security HDM: Agent free out of band management, supporting Redfish/IPMI/SNMP, virtual KVM, and batch firmware upgrades FIST: New H3C Full Lifecycle Deployment Tool, Zero Contact Online, Template based OS Installation Security: TPM 2.0/TCM 1.0, Intel TXT, firmware digital signature, chassis intrusion detection
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