SR868 V3 is supplied by HuaShengBoYe with verified origin and traceable batch information. We quote against your BOM, confirm packaging and date codes, and ship worldwide from Shenzhen.
processor Supports 1-4 Intel Xeon Gold/Platinum 4th generation expandable processors (such as Gold 6416H 18C/36T), with a maximum of 32 cores/250W per processor UPI 3.0 fully interconnected, improving multi-channel bandwidth and latency performance Memory and persistent memory 64 TruDDR5-5600, up to 16TB; also supports 32 Intel Optane PMem 300 series, which can be combined to form a 15TB+PMem memory pool, meeting SAP HANA and memory database requirements storage Front mounted maximum 48 × 2.5 "hot swappable disk slots, of which 24 can directly NVMe without the need for additional PCIe cards 2x7mm rear mounted+2xM.2 SATA/NVMe mirrored boot, supporting VROC, RAID 530/730, and other 12 Gb/s SAS RAID 0/1/5/6/10/50/60 Expansion and GPU The motherboard provides 16 x PCIe 5.0 slots (including 8 x 16)+2 x OCP 3.0, which can accommodate 4 dual width 350W GPUs or 8 single width 75W GPUs, meeting AI inference, 3D rendering, and scientific computing acceleration requirements Network and Management Onboard 2 × 10GbE-T; Scalable 25/40/100 GbE, InfiniBand through OCP 3.0 XClarity Controller 2 provides Redfish, remote KVM, and batch firmware updates; TPM 2.0, PFR hardware Root of Trust, chassis intrusion switch, meet enterprise security compliance requirements High availability design Honeycomb duct+hot swappable redundant fan; 800W/1100W/1600W/2000W 80 PLUS Platinum Power Supply N+N Redundancy Optical path diagnosis, PFA fault prediction, ASHRAE A4 environmental temperature support, MTBF ≥ 1 million hours typical scenario Large scale OLTP/OLAP, SAP HANA, virtualization integration, in memory computing, AI training and inference, private cloud/hybrid cloud resource pool
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