
ST650V3 is supplied by HuaShengBoYe with verified origin and traceable batch information. We quote against your BOM, confirm packaging and date codes, and ship worldwide from Shenzhen.
computing platform 2 pieces of 4th/5th generation Intel Xeon Scalable (Sapphire Rapids/Emerald Rapids), with a maximum of 32 cores and 250 watts per piece 32 DDR5-5600 DIMMs, with a maximum capacity of 4 TB, supporting RDIMM, 3DS RDIMM, and low-cost 9x4 DIMMs Expansion and GPU 5 x PCIe 5.0 (3 x x16+2 x x8)+4 x PCIe 4.0, up to 9 slots Up to 4 dual width active cooling GPUs or 8 single width GPUs to meet AI inference and VDI acceleration requirements storage capacity 32 × 2.5 "or 16 × 3.5" hot swappable disk slots; Native 12 x PCIe 4.0 NVMe port, capable of 24 x NVMe (full x4 without oversubscription) without the need for an additional card 2 x M.2 SATA/NVMe (supporting VROC or onboard RAID) Optional 8-/16-/32 port RAID/HBA (PCIe or CFF form), supports RAID 0/1/5/6/10/50/60 Network and I/O Onboard 2 × 10GbE-T (Broadcom BCM57416), supporting SRIOV, RoCE, DCB 1 x dedicated 1GbE management port; Optional OCP 3.0 card expansion for 25/40/100 GbE Management and Security XClarity Controller 2 (XCC2): HTML5 remote KVM, REST/Redfish, firmware batch update Platform Firmware Resilience (PFR) hardware Root of Trust, chassis intrusion switch TPM 2.0 Optional XClarity Energy Manager for power consumption strategy, heatmap analysis, and carbon emission reporting High availability design Hot swappable redundant fan+hot swappable 800 W/1100 W/1300 W 80 PLUS platinum/titanium power supply Honeycomb high-density ventilation holes improve heat dissipation efficiency, office environment noise ≤ 35 dBA Deployment form Tower type: 175 × 462 × 734 mm (maximum 39 kg) Convert to a 4U rack using the BA5Z conversion kit, supporting 559-914mm deep cabinets; No CMA, maintenance requires static guide rails
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